638060-40776

Description: Adhesive

Details: Two-part epoxy potting compound and adhesive with 1:1 mix ratio offering low viscosity for easy dispensing and potting of electronic and electrical components. Features noncorrosive properties to copper, excellent thermal shock resistance across temperature extremes, and strong bond strength to metals and composites. Designed for potting, encapsulation, and structural bonding of sensors, transformers, and electronic assemblies in aerospace applications where electrical insulation retention and environmental protection are critical.

Status: In-stock