DC Q3-3600

Description: Adhesive

Details: Two-part thermally conductive silicone encapsulant and adhesive with 1:1 mix ratio, low viscosity, and self-leveling properties. Exhibits thermal conductivity of 0.77 W/m-K, operates across -50°C to +200°C temperature range, and achieves UL 94 V-1 flame resistance rating. Designed for heat dissipation bonding in aerospace electrical and electronic component assemblies requiring thermal management and reliable structural adhesion.

Status: In-stock