EC3524 A/B

Description: Adhesive

Details: Two-part epoxy void filling and edge sealing compound designed for aerospace structural applications. This thixotropic paste offers extended pot life exceeding ninety minutes and cures at room temperature within forty-eight hours. The formulation features low density, one hundred percent solids content, flame-retardant properties meeting FAR 25.853 requirements, and service temperature range of minus fifty-five to eighty degrees Celsius. Applications include honeycomb sandwich edge close-out, corner reinforcement, and fairing work on aircraft assemblies.

Status: In-stock