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Material Name:
LOCTITE 3568
Description:
Black Liquid Epoxy
Details:
One-component black epoxy liquid underfill formulated for flip-chip, BGA, and CSP electronic assemblies. Features low viscosity, excellent temperature resistance, and outstanding electrical insulation properties. This reworkable underfill is used in aerospace avionics and electronics applications where thermal cycling reliability and component protection are critical.
Status:
In-stock |
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5 Minute
Quote Process
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Call Us
310-397-9896
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Email Us
sales@westernas.com
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Manufacturer Certification
INCLUDED
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Overnight Shipping (Hazmat Certified)
INTERNATIONAL
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