BAMS 553-001 TY2 CL3 GRE

Description: Copper Adhesive Screening

Details: Copper adhesive screening material designed for electromagnetic shielding and bonding applications in aerospace assemblies. This material provides conductive pathways to attenuate EMI and RFI while establishing structural adhesive bonds between copper foils and substrates. Used in avionics enclosures, cable shielding, and grounding connections where both electromagnetic protection and mechanical attachment are required.

Status: In-stock