SMS 77 TY1 CL2

Description: Copper Adhesive Screening

Details: Copper adhesive screening material used for electromagnetic interference shielding and electrical bonding in aircraft and aerospace electronics assemblies. Features conductive properties that enable point-to-point electrical contact and grounding while providing reliable adhesion to substrates. Suitable for EMI/RFI protection in avionics, communication systems, and high-reliability aerospace applications requiring consistent electrical conductivity and environmental resistance.

Status: In-stock