50-3100RFRGR

Description: Epoxy

Details: High thermal conductivity epoxy resin designed for rapid and sustained heat dissipation in aerospace electronic encapsulation and thermal interface applications. This one-hundred percent solids system exceeds military thermal shock requirements while maintaining low thermal expansion, making it suitable for potting and casting of avionics components, power electronics, and heat-sensitive assemblies exposed to wide temperature cycling in aircraft and defense systems.

Status: In-stock