AF163-2K

Description: Film Adhesive

Details: Thermosetting modified epoxy film adhesive engineered for structural bonding of metal and composite assemblies in aerospace applications. Delivers high fracture toughness and peel strength across a wide temperature range from -67°F to 250°F, with excellent moisture resistance before and after cure. Suitable for solid panel and honeycomb sandwich construction, featuring easy shop handling and short cure cycles at elevated temperatures.

Status: In-stock