FM 300-2M .03" x 50"

Description: Film Adhesive

Details: A thermoset epoxy film adhesive cured at 250°F (121°C) with 0.005-inch thickness and random mat carrier for structural bonding of aluminum and composite assemblies in aircraft applications. It maintains service capability from -55°F to 300°F, offers high shear strength and elongation, and accommodates stress concentrations at metal-to-composite bondlines. Suitable for co-cure and secondary bonding in both manufacturing and repair environments.

Status: In-stock