HCS2404-055-10

Description: Film Adhesive

Details: Unsupported thermosetting modified epoxy film adhesive designed for bonding composites, metal-to-metal, and metal-to-honeycomb components in aerospace applications. Provides continuous service capability at 350°F (177°C) with strength retention across a wide temperature range from -67°F to 350°F. Delivers excellent mechanical properties including high lap shear strength and fatigue resistance for primary structural bonding in aircraft components.

Status: In-stock