ALPHA WS-809 89.8-3-M18

Description: Flux

Details: Water-soluble solder paste flux containing 63 percent tin and 37 percent lead alloy designed for surface mount technology assembly and ball grid array rework applications. This flux provides superior wetting performance and cleanliness after aqueous post-reflow cleaning, reducing soldering defects and improving reliability in high-reliability electronic assemblies used in aircraft systems and avionics equipment.

Status: In-stock