ALPHA WS-809 89.8-4-M19

Description: Flux

Details: Water-soluble solder flux paste containing tin-lead alloy for surface mount assembly and ball grid array rework and repair operations. Designed for aqueous post-reflow cleaning with residues readily removed using heated deionized water. Exhibits excellent volume transfer efficiency and low voiding performance across standard and fine-pitch stencil printing applications in electronics manufacturing.

Status: In-stock