A50TF103-S8 CLB

Description: Structural Core Splice Adhesive

Details: Low-density expandable epoxy film adhesive designed for reinforcing and splicing honeycomb core materials in sandwich panel construction. Cures at either 250°F or 350°F and expands during cure to fill mismatched areas between different cell sizes. Used primarily in aerospace structural assemblies requiring lightweight core joining and edge sealing.

Status: In-stock